Outline
The invention relates to the use of pharmaceutical compositions containing as the active agent a compound of formula I in the treatment of dermal wounds. The compositions may be used for the promotion of healing of wounds affecting the deeper layers under the epithelium, including dermal- and sub dermal connective tissue, being cut, punctured, sliced wounds or originating in insufficient tissue perfusion, chronic diseases or other harms. The compositions are formulated for local application and may comprise other active agents contributing to wound healing in addition to a compound of formula (I).